Optimization and validation of thermal management for a RF front-end SiP based on rigid-flex substrate

Optimization and validation of thermal management for a RF front-end SiP based on rigid-flex substrate

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 65, October 2016, Pages 98-107

Peng Wu, Fengze Hou, Cheng Chen, Jun Li, Fengman Liu, Jing Zhang, Liqiang Cao, Lixi Wan,