کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
4971758 1450535 2016 10 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Effect of TiO2 additions on Sn-0.7Cu-0.05Ni lead-free composite solder
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Effect of TiO2 additions on Sn-0.7Cu-0.05Ni lead-free composite solder
چکیده انگلیسی
The effect of TiO2 addition on the microstructure, melting behavior, microhardness and interfacial reaction between Sn-0.7Cu-0.05Ni and a Cu-substrate were explored. Samples with various TiO2 percentages (0, 0.25, 0.5, 0.75 and 1.0 wt.%) were prepared using a microwave-assisted sintering powder metallurgy method. Microstructural analysis reveals that TiO2 was uniformly distributed along the grain boundary of the bulk solder. Differential scanning calorimetry (DSC) results showed a decrease in the undercooling while melting temperature of the solder slightly increase. The thickness of the interfacial intermetallic compounds of the solder joint was reduced with the addition of TiO2 particles. This thickness reduction indicates that the presence of a small amount of TiO2 particles is effective in suppressing the growth of the intermetallic compound layer. Small dimples on the fracture surface have revealed that the Sn-Cu-Ni composite solder exhibits typical ductile failure. Overall, the addition of TiO2 to Sn-0.7Cu-0.05Ni solder dramatically increases its shear strength and hardness and improves its wetting properties and fracture surface.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 65, October 2016, Pages 255-264
نویسندگان
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