کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
4971788 | 1450533 | 2016 | 8 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Constitutive modeling of solder alloys for drop-impact applications
ترجمه فارسی عنوان
مدل سازی سازه ای از آلیاژهای لحیم کاری برای برنامه های کاربردی ضربه
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی کامپیوتر
سخت افزارها و معماری
چکیده انگلیسی
The stress-strain data of four solder alloys - Sn37Pb, Sn1·0Ag0.1Cu, Sn3·5Ag, and Sn3·0Ag0.5Cu - at seven initial strain rates between 0.005 sâ 1 to 300 sâ 1 have been generated using a combination of mechanical and drop-weight compression tests. Assuming negligible inertia of the test specimen, the stress-strain-strain rate characteristics Ï(ε,εÌ(ε)) of a solder alloy can be readily evaluated from the measured time history of the impact force in a drop-weight compression test. The stress-strain-strain rate characteristics are transformed to the condition of isostrain rate Ï(ε,εÌiso) while being curve-fitted to the Johnson-Cook and the Pernzya models. The former represents the dynamic-yield model and the latter the viscoplastic model. The quality of the extracted material constants for the Johnson-Cook model are validated by (i) reproducing the impact force-time characteristic of the Sn37Pb solder test specimen using finite element analysis and using the extracted material constants; and (ii) extracting the material constants for the Sn37Pb solder alloy using the inherent optimisation capability of commercial finite element code.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 67, December 2016, Pages 135-142
Journal: Microelectronics Reliability - Volume 67, December 2016, Pages 135-142
نویسندگان
E.H. Wong, J. Chrisp, C.S. Selvanayagam, S.K.W. Seah,