Model-fitting kinetic analysis of novel phosphorus-containing curing agent for epoxy resin

A hyper branched modified-amine curing agent N,N,N-tris(4-amino-diphenylmethane) Phosphoric Triamide (TEPDDMs) was prepared by one-step way with 4, 4-diaminodiphenylmethane (DDM) and triethyl phosphate (TEP) as raw materials. The reaction condition was determined by isothermal DSC method, Molecular structure of synthetic curing agent was confirmed by FTIR method. Utilizing the non-isothermal Differential Scanning Calorimeter curve, the cure kinetic of this curing system was researched through Málek method, during the analysis of this thermal treatment, kinetic parameters were determined, kinetic model was built and curing behavior under dynamic conditions was predicted. Results indicate that the curing reaction conforms to the Å¡estάk-Berggren model; moreover, the model-predictive curve coincides well with the experimental data, which verifies the accuracy of the model. LOI test and TGA analysis indicate that epoxy resin cured by TEPDDMs exhibit excellent flame- retardant property and better thermal stability compared to epoxy resin cured by DDM.