Shear test on hard coated flip-chip bumps to measure back end of the line stack reliability

The focus of this work is to demonstrate a new reliable microscale test technique performed using nano-indenter to measure the mechanical reliability of BEOL stacks. A high-load spherical head is used to apply a known displacement on a solder bump coated with a ceramic. The force initial increases and suddenly drops indicating failure. Cross-sections of the tested bumps clearly indicate crack propagating through the BEOL stack while the coated bump remains intact. Since the forces subjected on the bump during the test is similar to the forces subjected on the bump during flip-chip assembly, the critical force can be used as a measure of fracture strength of the BEOL stack. The results from the test indicate that the critical force varies from bump to bump and the results are repeatable. Furthermore, finite-element model of the test is developed. The failure of the ILD layers is simulated using cohesive zone (CZ) elements and the mixed-mode traction-separation parameters required to characterize the CZ elements are extracted from macro-scale test techniques like DCB and FPB tests. The force-displacement (P-Δ) plot from the model mimics the experiment and predicts the average value of the critical force observed in experiment.