کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
5014842 | 1463464 | 2017 | 20 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Dielectric analysis as a cure monitoring system for UF particle boards
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
سایر رشته های مهندسی
مهندسی مکانیک
پیش نمایش صفحه اول مقاله
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چکیده انگلیسی
In the present work, DEA cure monitoring was tested in pilot plant scale production of urea-formaldehyde (UF) based particle boards. The measurements were performed during hot-pressing; the pressing times and binder types were varied. The degree of curing was calculated from logarithmic ion viscosity values. Sufficient cross-linking resulted in a significant increase of the ion viscosity. The logarithmic ion viscosity values which are measured at the end of the pressing process were correlated with the transverse tensile strength of the obtained particle boards.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: International Journal of Adhesion and Adhesives - Volume 73, March 2017, Pages 45-50
Journal: International Journal of Adhesion and Adhesives - Volume 73, March 2017, Pages 45-50
نویسندگان
Uwe Müller, Claudia Pretschuh, Roland Mitter, Stephan Knappe,