Dielectric analysis as a cure monitoring system for UF particle boards

In the present work, DEA cure monitoring was tested in pilot plant scale production of urea-formaldehyde (UF) based particle boards. The measurements were performed during hot-pressing; the pressing times and binder types were varied. The degree of curing was calculated from logarithmic ion viscosity values. Sufficient cross-linking resulted in a significant increase of the ion viscosity. The logarithmic ion viscosity values which are measured at the end of the pressing process were correlated with the transverse tensile strength of the obtained particle boards.