Rapid formation of Ni3Sn4 joints for die attachment of SiC-based high temperature power devices using ultrasound-induced transient liquid phase bonding process

Rapid formation of Ni3Sn4 joints for die attachment of SiC-based high temperature power devices using ultrasound-induced transient liquid phase bonding process

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Ultrasonics Sonochemistry - Volume 36, May 2017, Pages 420-426

Z.L. Li, H.J. Dong, X.G. Song, H.Y. Zhao, J.C. Feng, J.H. Liu, H. Tian, S.J. Wang,