Incorporation of Tin on copper clad laminate to increase the interface adhesion for signal loss reduction of high-frequency PCB lamination

Incorporation of Tin on copper clad laminate to increase the interface adhesion for signal loss reduction of high-frequency PCB lamination

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Applied Surface Science - Volume 422, 15 November 2017, Pages 738-744

Chong Wang, Na Wen, Guoyun Zhou, Shouxu Wang, Wei He, Xinhong Su, Yongsuan Hu,