کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
5351522 | 1503671 | 2014 | 9 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Low temperature plasma sintering of silver nanoparticles
ترجمه فارسی عنوان
پلاسما در دمای پایین دمای نانوذرات نقره را کاهش می دهد
دانلود مقاله + سفارش ترجمه
دانلود مقاله ISI انگلیسی
رایگان برای ایرانیان
کلمات کلیدی
پلاسما، نانوذرات، پختن نقره، پردازش دمای پایین،
موضوعات مرتبط
مهندسی و علوم پایه
شیمی
شیمی تئوریک و عملی
چکیده انگلیسی
The fabrication of flexible electronics using the deposition of solution-processed nanomaterials generally requires low-temperature post-processing to optimize functionality. We studied sintering of silver nanoparticle (AgNP) films on glass substrates by applying argon (Ar) plasma to achieve improved electrical conductivity. This process meets the low temperature processing requirements for standard low-cost polymeric flexible substrates. The relationship between plasma parameters (such as power and sintering time) versus sintering results (such as electrical sheet resistance, sintered structure depth, materials composition variation, and film nanostructure) is reported for 23 and 77Â nm diameter AgNPs. In addition, plasma processing typically induces a small surface thermal effect. We monitored the surface temperatures of the AgNP films in-situ during plasma sintering. By sintering control groups at these monitored surface temperatures using a vacuum oven, we confirmed that the resistivity due to plasma sintering is less than that produced by thermal sintering. Our data show that, the measured lowest resistivities for plasma sintered AgNP films are about only 5 and 12 times greater than the bulk Ag resistivity for 23 and 77Â nm, respectively.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Applied Surface Science - Volume 293, 28 February 2014, Pages 207-215
Journal: Applied Surface Science - Volume 293, 28 February 2014, Pages 207-215
نویسندگان
Siyuan Ma, Vadim Bromberg, Liang Liu, Frank D. Egitto, Paul R. Chiarot, Timothy J. Singler,