UV laser direct texturing for high efficiency multicrystalline silicon solar cell

► “As-cut”, p-type, multicrystalline silicon wafers of 200 μm thickness and 4.5 cm × 4.5 cm. ► UV laser direct texturing and etching mask layer of SiNx with 300 nm. ► 1064 fiber laser texturing and etching mask layer of SiNx with 300 nm. ► Etching was essential to remove slag and damages from the laser. ► Densely-packed V-shaped textures were more effective for capturing photons than the U-shaped.