Activation of electroplated-Cu surface via plasma pretreatment for low temperature Cu-Sn bonding in 3D interconnection

Activation of electroplated-Cu surface via plasma pretreatment for low temperature Cu-Sn bonding in 3D interconnection

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Applied Surface Science - Volume 384, 30 October 2016, Pages 200-206

Junqiang Wang, Qian Wang, Ziyu Liu, Zijian Wu, Jian Cai, Dejun Wang,