The effects of pore and second-phase particle on the mechanical properties of machining copper matrix from molecular dynamic simulation

- Nanometric machining porous metals and metal matrix composites are investigated.
- Pore and particle effects on machining properties are studied.
- Machining-induced pore healing is observed.
- Particle induces work hardening.
- Friction coefficient depends on the existence of pore and particle.

The subsurface damage and surface integrity of a spherical diamond indenter sliding against a face-centred cubic copper (100) surface considering the pore and second-phase particle effects is investigated by means of molecular dynamic simulations of nanoindentation followed by nanomachining. In this investigation, we establish an analytical model for pore healing, and provide a criteria to determine whether or not pore can be healed. The results show that with increase of machining distance pore becomes smaller and then closes due to machining-induced compressive stress, resulting in low material damage and strong structure stability. Compared to free pore workpiece, machining force slightly relies upon the existence of pore and second-phase particle while friction coefficient strongly depends on the existence of that. In addition, particle induces work hardening due to Lomere-Cottrel lock and dislocation slip during machining metal matrix composites. It is helpful to understand the relation of machining performance and material parameter for obtaining higher surface integrity and lower subsurface damage during machining porous metals and particle reinforced metal matrix composites.

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