Removal of nanoparticles from a silicon wafer using plasma shockwaves excited with a femtosecond laser

► The experimental setup for the removal of nanoparticles using plasma shockwaves formed by a femtosecond pulsed laser. ► Removal of PSL nanoparticles from the silicon wafer surface as a function of the gap distance and particle counting. ► The removal efficiency of the nanoparticles reached 95% without surface damage when the gap distance was 150 μm.