Effects of Cr buffer layer thickness on the microstructure and the properties of Ni thin films deposited on polyimide substrate

► Cr buffer layers with different thickness were deposited between the Ni films and the soft material substrates like polyimide. ► Correlation between the Cr buffer layer thickness and the properties of Ni film is achieved. ► The optimal Cr buffer layer thickness was 11.8 nm, which gave the lowest residual stress and resistivity, and the highest TCR value of Ni thin film. ► The effect of inter diffusion at Ni/Cr interface on the electrical properties of films was analyzed by the description of interface resistance.