Ti-Cu-N hard nanocomposite films prepared by pulse biased arc ion plating

► Ti-Cu-N nanocomposite films were deposited by pulse biased arc ion plating. ► The Cu content depended on the pulse bias voltage. ► The maximum value of hardness reaches 31.5 GPa at −600 V, with Cu content of 1.75 at.%. ► The maximum value of adhesion of the film with 74 N was obtained at pulse bias −900 V.