Fabrication and adhesion performance of gold conductive patterns on silicon substrate by laser sintering

► We investigate the effects of laser power on microstructure and adhesion of gold conductive patterns. ► The microstructure of gold film became denser with increase of laser power. ► Elevating laser power will increase the adhesion of gold film. ► The adhesion mechanism corresponds to physical adsorption and chemical bond mechanisms. ► Al wire was successfully bonded to sintered gold conductive patterns.