Influence of a hot and humid environment on thermal transport across the interface between a Ag thin-film line and a substrate

- Current-stressing experiments were performed for a Ag thin-film line on a Si substrate.
- The influence of a hot and humid environment on the thermal transport across the Ag/Si interface was investigated.
- The electrical resistivity of the line increased with the exposure time in the hot and humid environment.
- Interfacial thermal conductance decreased due to the formation of voids within the line.