Stress evolution of Au/Cu/Au tri-layer systems during annealing

► We present a experimental observations of the measurements of the average force per width during deposition and annealing of Au/Cu/Au tri-layers attached to silicon substrate. ► We find that one cycle of annealing is sufficient to achieve the thermomechanical stability of the Au/Cu/Au tri-layer systems. ► The beginning of deviation from linear part of stress curve can identify the temperature at which plastic deformation processes occurring in materials of the multilayer.