Interpolymer complexes of poly(acrylic acid) and poly(ethylene glycol) for low dishing in STI CMP

- We propose the PAA-PEG interpolymer complex as a passivation agent for low dishing with high selectivity between SiO2 and Si3N4.
- PAA can form the interpolymer complex with PEG through the H-bonding.
- During the over-polishing step, the cross-linked network structure of the PAA-PEG interpolymer complex prevents abrasives from polishing SiO2 in the trenches, resulting in a significant decrease in dishing.