Electrical properties of SiGe nanowire following fluorine/nitrogen plasma treatment

The improvements to electrical properties of SiGe nanowires by surface plasma treatment were investigated. Various durations of pre-oxidation with fluorine; ambients for post-nitridation plasma treatment, and annealing temperature after plasma treatment, 800-950 °C, were applied. Pre-oxidation treatment using fluorine plasma; improved the conductance of SiGe nanowires because the Si-F binding energy created a more stable interface state than bare nanowire on the surface of SiGe. N2 plasma incorporated more N than does in NH3 plasma, and NH3 has the drawback of introducing electron traps, causing Si-H bonds to break in the subsequent annealing process. Since the reparation of surface defects by plasma treatment is valid, the high post-annealing temperature to reduce defect by re-crystallizing can be reduced. Hence, Ge diffusion at low post-annealing temperature did not reduce the high concentration of Ge at the SiGe nanowire surfaces.