Physical mechanism of silicon ablation with long nanosecond laser pulses at 1064Â nm through time-resolved observation

▶ Long nanosecond pulsed laser ablation of silicon at 1064 nm has been studied. ▶ Material removal occurs through vaporization followed by liquid ejection. ▶ Ejected liquid front changes linearly with time. ▶ Liquid ejection is unlikely due to phase explosion.