Simulation of the interface characterization of thin film on substrate system by bending creep tests

In the present paper, the finite element simulation of the bending creep tests of the thin film on substrate system is carried out. The purpose of the investigation is to understand the creep stress characterization of the thin film on substrate system with the three points bending creep test method, which plays an important role in the bending creep testing characterization, so as to provide some foundation on determination of interface properties of the thin film on substrate system by a bending creep testing. Finite element results shows that the influences of the thickness of thin film and the modulus ratio of thin film to substrate on stress distribution are important.