کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
5360151 1388257 2009 4 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Invalidating mechanism of bis (3-sulfopropyl) disulfide (SPS) during copper via-filling process
موضوعات مرتبط
مهندسی و علوم پایه شیمی شیمی تئوریک و عملی
پیش نمایش صفحه اول مقاله
Invalidating mechanism of bis (3-sulfopropyl) disulfide (SPS) during copper via-filling process
چکیده انگلیسی
The invalidating process and related mechanism of bis (3-sulfopropyl) disulfide (SPS) during copper via-filling process were investigated by means of electrochemical polarization measurement, and the mass spectrometry (MS) testing was employed to confirm the molecular weight (MW) and the structure of SPS invalidating products. Meanwhile, quantum chemistry calculation was used to verify the rationality of the proposed invalidating course. These results suggest that the solution containing SPS has invalidated after the passed charges (PC) reached 15 Ah L−1 under electrifying condition. The adsorption ability of SPS decrease gradually with the increase of PC during the invalidating process. The invalidation of SPS is an oxidation process related to the dissolved oxygen in the solution, during which the active functional group -S-S- is oxidized to -SOx-SOy-. As a result, the accelerating effect of SPS on copper reduction will gradually diminish.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Applied Surface Science - Volume 255, Issue 8, 1 February 2009, Pages 4389-4392
نویسندگان
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