Four-zone solidification microstructure formed by laser melting of copper thin films

Polycrystalline copper film microstructures produced by laser melting and rapid lateral solidification are analyzed using transmission electron microscopy. The microstructure is predominantly composed of directionally solidified grains up to 22 μm long and 1 μm wide lying in the plane of the film. We identify four morphologically solidification zones, corresponding to occlusion, steady lateral growth, defective growth, and nucleation. Electron diffraction analysis indicates clustering of 〈1 0 0〉 orientations around the direction of solidification for the grains in the steady lateral growth zone. Simple estimates of solidification times based on heat flow modeling and a critical nucleation temperature suggest that interface velocities of several hundred m/s may be attained during solidification.