Numerical investigation on thermal properties at Cu-Al interface in micro/nano manufacturing

► We proposed a hybrid model by integrating TTM (two-temperature model) and MD (molecular dynamics). ► We investigated the properties on interface of dissimilar materials under thermal flux conditions. ► We detected the fantastic change on Cu-Cu interface and Cu-Al interface. ► We investigated the propagation mechanisms of nanocracks. ► It implies a potential method for design interface structure in micro/nano manufacturing.