Thermosetting polyimide resin matrix composites with interpenetrating polymer networks for precision foil resistor chips based on special mechanical performance requirements

Based on interpenetrating networks (IPNs) different macromolecular materials such as epoxy, phenolic, and silicone resin were chosen to modify thermosetting polyimide (TSPI) resin to solve the lack of performance when used for protecting precision foil resistor chips. Copolymerization modification, controlled at curing stage, was used to prepare TSPI composites considering both performance and process requirements. The mechanical properties related to trimming process were mainly studied due to the special requirements of the regularity of scratch edges caused by a tungsten needle. The analysis on scratch edges reveals that the generation and propagation of microcracks caused by scratching together with crack closure effect may lead to regular scratch traces. Experiments show that the elongation at break of TSPI composites is the main reason that determines the special mechanical properties. The desired candidate materials should have proper hardness and toughness, and the specific mechanical data are that the mean elongation at break and tensile strength of polymer materials are in the range of 9.2-10.4% and 100-107 MPa, respectively. Possible reasons for the effect of the modifiers chosen on TSPI polymers, the reaction mechanisms on modified TSPI resin and the IPN structure in TSPI composite polymers were discussed based on IR and TG analysis.