Thermal stability and electrical characteristics of NiSi films with electroplated Ni(W) alloy

► Electroplating deposited NiW alloying films as diffusion barrier layers. ► The barrier performance of NiW films was improved with W atom blocked. ► Cu atom is hardly diffuse through NiW barrier layer. ► The stacked Si/Ni(W)/Cu films is perfect at 600 °C.