کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
5364858 | 1388321 | 2009 | 6 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Comparative study of electroless copper deposition based on the seed layers of Pd, PtPd and AuPd
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
شیمی
شیمی تئوریک و عملی
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چکیده انگلیسی
The article reports on electroless deposition of copper films onto p-silicon (1 0 0) using different seed (co-seed) layers of Pd, PtPd and AuPd. The dependence of the compositions and morphologies of different seed layers on resultant Cu films were comparatively studied in detail by atomic force microscopy (AFM), field emission scanning electron microscope (FE-SEM) and X-ray photoelectron spectroscopy (XPS). The activities of electroless copper deposition on the p-silicon (1 0 0) with different seed (co-seed) layers were evaluated by polarization curve. It is concluded that the bimetallic AuPd seed displayed the highest catalytic activity for electroless copper deposition, and followed by the order of PtPd > Pd.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Applied Surface Science - Volume 255, Issue 6, 1 January 2009, Pages 3713-3718
Journal: Applied Surface Science - Volume 255, Issue 6, 1 January 2009, Pages 3713-3718
نویسندگان
Chuanli Ma, Weichun Ye, Xuezhao Shi, Yanlong Chang, Yang Chen, Chunming Wang,