کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
5364858 1388321 2009 6 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Comparative study of electroless copper deposition based on the seed layers of Pd, PtPd and AuPd
موضوعات مرتبط
مهندسی و علوم پایه شیمی شیمی تئوریک و عملی
پیش نمایش صفحه اول مقاله
Comparative study of electroless copper deposition based on the seed layers of Pd, PtPd and AuPd
چکیده انگلیسی

The article reports on electroless deposition of copper films onto p-silicon (1 0 0) using different seed (co-seed) layers of Pd, PtPd and AuPd. The dependence of the compositions and morphologies of different seed layers on resultant Cu films were comparatively studied in detail by atomic force microscopy (AFM), field emission scanning electron microscope (FE-SEM) and X-ray photoelectron spectroscopy (XPS). The activities of electroless copper deposition on the p-silicon (1 0 0) with different seed (co-seed) layers were evaluated by polarization curve. It is concluded that the bimetallic AuPd seed displayed the highest catalytic activity for electroless copper deposition, and followed by the order of PtPd > Pd.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Applied Surface Science - Volume 255, Issue 6, 1 January 2009, Pages 3713-3718
نویسندگان
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