کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
5366757 | 1388354 | 2007 | 6 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
A mathematical model for material removal and chemical-mechanical synergy in chemical-mechanical polishing at molecular scale
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
شیمی
شیمی تئوریک و عملی
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: A mathematical model for material removal and chemical-mechanical synergy in chemical-mechanical polishing at molecular scale A mathematical model for material removal and chemical-mechanical synergy in chemical-mechanical polishing at molecular scale](/preview/png/5366757.png)
چکیده انگلیسی
This paper presents a mathematical material removal model based on the chemical and mechanical synergistic effects in the chemical-mechanical polishing (CMP) process. It seems to explain the transition from a chemically dominant region to a mechanically dominant region. In addition, this model predicts the effects of most variables involved in the CMP process including the processing conditions (velocity, downpressure), pad properties (modulus, hardness and asperity sizes) and slurry characteristics (particle size, concentration and distribution). The results reveal some insights into the micro-contact and wear mechanisms of the CMP process.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Applied Surface Science - Volume 253, Issue 20, 15 August 2007, Pages 8489-8494
Journal: Applied Surface Science - Volume 253, Issue 20, 15 August 2007, Pages 8489-8494
نویسندگان
J. Bai, Y.W. Zhao, Y.G. Wang,