کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
5367306 | 1388364 | 2009 | 5 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Influence of crystal orientation on copper oxidation failure
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موضوعات مرتبط
مهندسی و علوم پایه
شیمی
شیمی تئوریک و عملی
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چکیده انگلیسی
The influences of crystal orientation on copper oxidation were investigated. The results indicated that crystal orientation of copper substrate has a great effect on the growth rate, the morphology of oxide film and the extent of oxidation failure. Shear test showed the adhesion strength between Cu(1Â 1Â 0) and its oxide film was the highest, whereas, the adhesion strength between Cu(3Â 1Â 1) and its oxide film was the lowest. SEM observations revealed that the oxide film grown on Cu(3Â 1Â 1) delaminated from substrate seriously, while the oxide film grown on Cu(1Â 0Â 0) and Cu(1Â 1Â 0) did not reveal such a phenomenon. Cu(1Â 0Â 0) and Cu(1Â 1Â 0) exhibited thinner oxide thickness compared to those on Cu(3Â 1Â 1) and Cu(1Â 1Â 1). The activation energy for oxide growth on Cu(1Â 0Â 0) and Cu(1Â 1Â 0) was calculated to be the highest while that on Cu(3Â 1Â 1) was the lowest.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Applied Surface Science - Volume 255, Issue 11, 15 March 2009, Pages 5943-5947
Journal: Applied Surface Science - Volume 255, Issue 11, 15 March 2009, Pages 5943-5947
نویسندگان
Jie Gao, Anmin Hu, Ming Li, Dali Mao,