کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
5369035 | 1388419 | 2009 | 5 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Stress distribution and hillock formation in Au/Pd thin films as a function of aging treatment in capacitor applications
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
شیمی
شیمی تئوریک و عملی
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چکیده انگلیسی
Effect of quenching in different media on hillock formation and electrical resistivity has been studied in the Au-Pd layers. Oxygen was released from substrate due to substrate relaxation process. It was suggested that hillocks appear on the triple junction grain boundaries. However, lower electrical resistivity has been seen in the sample which quenched in the air. It was concluded that grain boundary scattering decreases the conductivity of the quenched films due to higher density of dislocations.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Applied Surface Science - Volume 255, Issue 22, 30 August 2009, Pages 8995-8999
Journal: Applied Surface Science - Volume 255, Issue 22, 30 August 2009, Pages 8995-8999
نویسندگان
S. Nazarpour, O. Jambois, C. Zamani, F. Afshar, A. Cirera,