کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
5370075 1388470 2006 5 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Use of the direct negative Cu ion beam deposition for the control of the properties of Cu thin film
موضوعات مرتبط
مهندسی و علوم پایه شیمی شیمی تئوریک و عملی
پیش نمایش صفحه اول مقاله
Use of the direct negative Cu ion beam deposition for the control of the properties of Cu thin film
چکیده انگلیسی

Direct metal ion beam deposition (DMIBD) technique for Cu thin film metallization is characterized. With suitable operating conditions, secondary Cu− ion yield, ion/atom arrival rate ratio, ion beam energy spreads were optimized at 15%, 0.3, and 10%, respectively.After optimization of DMIBD system, the effect of Cu ion beam energy on the resistivity, adhesion strength, and surface morphology of Cu thin film was investigated. TEM micrograph shows that the film prepared at 75 eV was polycrystalline, while the film prepared at 0 eV was vertical columnar structure.As ion beam energy is increased from 25 to 75 eV, the resistivity is decreased from 6.21 to 2.09 μΩ cm, while the critical load to cause adhesion failure was increased to about 13 N at 200 eV, which is four-times higher that that of 25 eV.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Applied Surface Science - Volume 253, Issue 4, 15 December 2006, Pages 2127-2131
نویسندگان
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