Phase defect inspection of multilayer masks for 13.5 nm optical lithography using PEEM in a standing wave mode

We report on recent developments of an “at wavelength” full-field imaging technique for defect inspection of multilayer mask blanks for extreme ultraviolet lithography (EUVL). Our approach uses photoemission electron microscopy (PEEM) in a near normal incidence mode at 13.5 nm wavelength to image the photoemission induced by the EUV wave field on the multilayer blank surface. We analyze buried defects on Mo/Si multilayer samples down to a lateral size of 50 nm and report on first results obtained from a six inches mask blank prototype as prerequisite for industrial usage.