Improvement of thermal conductivities for PPS dielectric nanocomposites via incorporating NH2-POSS functionalized nBN fillers

The proposed combining method of silane coupling agent of γ-aminopropyl triethoxy silane/aminopropyllsobutyl polyhedral oligomeric silsesquioxane (KH-560/NH2-POSS) was performed to functionalize the surface of hexagonal nanometer boron nitride fillers (f-nBN), aiming to fabricate the f-nBN/polyphenylene sulfide (f-nBN/PPS) nanocomposites with excellent thermal conductivities, outstanding thermal stabilities and optimal dielectric properties. The usage of f-nBN fillers was benifit for improving the thermally conductive coefficient (λ) and decreasing dielectric constant (ε) values of the PPS nanocomposites. The f-nBN/PPS nanocomposite with 60 wt% f-BN fillers was an excellent dielectric nanocomposite with high λ & ideal ε values and outstanding thermal stability, λ of 1.122 W/m K (increased by 400% compared to that of pristine PPS matrix), ε of 3.99 and THeat-resistance index (THRI) beyond 275 °C, which holds potential for electronic packaging materials and ultra high voltage electrical apparatus.