Enhanced thermal conductivity of functionalized-graphene/boron nitride flexible laminated composite adhesive via a facile latex approach

Flexible fiber-reinforced laminated composite adhesive combining with functionalized-graphene (f-G) layer and hexagonal boron nitride (h-BN) layer was prepared by colloid-blending and self-assembly technology with the assistance of the secondary force and hydrophilic difference. In this system, poly (2-ethylhexyl acrylate) (P2EHA) as the polymer matrix linked the layer of functionalized-graphene and another layer of hexagonal boron nitride like the cross-linker or adhesive via self-assembly technology. Lewis acid-base (δ+−δ−) interaction and π-π stacking improved the compatibility between the filler and the polymer matrix. The effective and successful fabrication of flexible f-G/h-BN laminated composite adhesive has been confirmed by SEM, Raman spectroscopy, and XRD investigations. The oriented stacking and laminated structure resulted in much higher in-plane thermal conductivities (∼4.20 W/m K) and insulation in the direction through the plane and good adhesive properties. The procedure was environmental friendly, easy operation, and potential for the practical application in industry.