کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
544705 | 871777 | 2015 | 7 صفحه PDF | دانلود رایگان |
• Warp-based PCB design rules were examined from their physical consistency.
• Maximum stress in a bent PCB relies better on its curvature but less on its warp.
• A novel design criterion based on curvature is proposed for bent boards.
• A threshold curvature form is assessed for adhesively bonded components.
Space electronics are subjected to severe vibration environment. The present paper examines empirical warp-based design rules of electronic boards, i.e., criteria verifying that the ratio of maximum board warp to its length remains below a threshold percentage. An analytical approach assessed that peak stress of the board stems better from its curvature than its warp. The same applies to the adhesive peak stress by investigating a finite element model of an adhesively bonded component. Alternatively, a modified formulation based on board curvature is proposed and a threshold curvature is assessed.
Journal: Microelectronics Reliability - Volume 55, Issue 12, Part B, December 2015, Pages 2786–2792