Recent fluid–structure interaction modeling challenges in IC encapsulation – A review

• We review the fluid–structure interaction (FSI) modeling of IC encapsulation.
• We focus the FSI phenomena in IC encapsulation.
• The significance and challenges of FSI analysis are highlighted in this article.
• De-coupling and real-time coupling methods are typically used in FSI analysis.

The rapid development of computing software has facilitated multifarious research in integrated circuit (IC) packaging. Complicated and complex processes can be visualized via simulation modeling with this software. The applications of aided software enhance the fundamental physicochemical understanding and visualization of the IC encapsulation process. In this article, fluid–structure interaction (FSI) during IC encapsulation through computer-aided simulation is reviewed based on the amount of substantial work conducted from the past decades to the present. FSI phenomena in various IC encapsulations, such as wire sweep, paddle shift, lead frame deformation, IC chip, and through-silicon via (TSV) deformation, is considered in the review. The significance and challenges of FSI analysis are also highlighted in this article.

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