One step process of decomposition and polymerization to fabricate SiO2 hollow spheres/polyimide composite for foldable OLEDs

- We fabricated hybrid films of SHS/PI by using a one step process with SODP.
- The film has ultralow dielectric constant (50 vol% at k = 1.67).
- There is no collapse of SiO2 hollow spheres in the PI matrix after bending test for 50,000 cycles.

The fabrication of interlayer dielectrics (ILDs) in flexible organic light-emitting diodes (OLEDs) requires flexible materials with a low dielectric constant as well as materials with excellent electrical, thermal, and mechanical properties for optimal device performance. Hybrid films of SiO2 hollow spheres (SHS)/polyimide (PI) were prepared using a one-step process, with simultaneous occurrence of decomposition (polystyrene, PS) and polymerization (PI) (SODP). No collapse of SiO2 hollow spheres in PI was observed from 10 vol% to 60 vol% SHS in hybrid films. The dielectric constant of hybrid films was reduced from 3.45 to 1.67 and was saturated at above 50 vol% of SHS due to the maximum fill factor of SHS in the PI matrix. The thermal stability was excellent up to 500 °C due to the inherent thermal property of PI. After a bending test for 50,000 cycles at a bending radius of 1 mm, the SHS/PI hybrid films retained their dielectric constant and current density. These results indicate the hybrid film to be the most promising candidate for flexible ILDs with a low dielectric constant and high thermal stability for foldable OLEDs.

The SiO2 hollow spheres and polyimide hybrid synthesized using one step process, simultaneous occurrence of decomposition and polymerization (SODP) is useful with a ultra-low dielectric constant and high thermal stability for flexible OLED.127