The influence of electroless metallization process parameters on basic electric properties of Ni–P alloy

• Optimization of electroless manufacturing process of Ni–P resistors was carried out.
• TCR values was minimized by pH and the substrates concentration adjustment.
• The optimal pH of the technological solution was found to be 1.70.
• The changes in TCR are a linear function of the process duration.
• The intensification of the process leads to negative TCR values.

This paper presents the modification of manufacturing process parameters and the effect of this on electroless deposited Ni–P resistive layers. By modifying the manufacturing technology of the resistive layer in the electroless metallization process a minimization of the Temperature Coefficient of Resistance (TCR) for fixed resistors obtained with the use of Ni–P alloys was achieved. The optimization of bath acidity, and process intensification as a result of the increase in the concentration of basic parent substances were the main factors influencing the features of the resistive layer.