کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
545033 871802 2013 6 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile
چکیده انگلیسی

Package warpage is an important factor to the effect of yield of board assembly, delamination, solder joint fatigue reliability and other thermal stress issues. Reduction of warpage is always the ultimate purpose for enhancing the service life. HFBCGA equipped only peripheral stiffener ring is selected to investigate the effect of heating rate, with and without ball mounted, moisture sensitivity level, white-coated paint on package and glass gratings to the warpage subjected to a reflow soldering-liked profile. Releasing viscoelasticity at processing temperature, maintaining structural rigidity of the residual solder, certain moisture resistivity at MSL 3, and light white paint help on reducing the warpage along the reflow soldering-liked profile.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 53, Issue 2, February 2013, Pages 297–302
نویسندگان
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