Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn–9Zn binary eutectic solder alloy

In this study, an addition of Ag micro-particles (8–10 μm) with a content in the range between 0 and 1.5 wt.% to Sn–9Zn eutectic solder, were examined in order to understand the effect of Ag additions as the particulate reinforcement on the microstructural and mechanical properties as well as the thermal behavior of the newly developed composite solders. Here, an approach to prepare a micro-composite solder alloy by mixing Ag micro-particles with a molten Sn–Zn solder alloy was developed. The composite solder was prepared by mechanically mixing Ag micro-particles into the Sn–9Zn alloy melt to ensure a homogeneous distribution of the reinforcing particles. The distribution of the Ag micro-particles in the matrix was found to be fairly uniform. The Ag particles reacted with the Zn and formed ε-AgZn3 intermetallic compounds (IMC) in the β-Sn matrix. It was found that the more Ag particles added to the Sn–9Zn solder, the more Ag–Zn compound formed. In the Sn–9Zn/XAg composite solder, the microstructure was composed of AgZn3 IMC and α-Zn phase in the β-Sn matrix. Interestingly, as the Ag particles in the composite solder increased, the α-Zn phase was found to be depleted from the matrix. The average tensile strength of the composite solders increased with the Ag micro-particles content up to a certain limit. Beyond this limit, the addition of Ag particles actually decreased the strength.