Microstructure evolution and bonding mechanism of Ti2SnC-Ti6Al4V joint by using Cu pure foil interlayer

Microstructure evolution and bonding mechanism of Ti2SnC-Ti6Al4V joint by using Cu pure foil interlayer

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Characterization - Volume 127, May 2017, Pages 53-59

W. Yu, H. Zhao, Z. Huang, X. Chen, Y. Aman, S. Li, H. Zhai, Z. Guo, S. Xiong,