Nanostructured pure copper fabricated by simple shear extrusion (SSE): A correlation between microstructure and tensile properties

In the present paper the variation of microstructural parameters and tensile properties of ultrafine-grained copper processed by simple shear extrusion (SSE) via namely route C in 1, 2, 4, 6, 8 and 12 passes is described. TEM analysis showed that the microstructure evolves from lamellar boundaries and elongated cells towards a more equiaxed homogeneous microstructure. After 12 passes, the grain fragmentation occurred in all the directions without any significant elongation in the grains. The minimum cell size is achieved after eight passes. Evaluation of dislocation density using scanning transmission electron microscopy observations shows a gradual increase of dislocation from one to eight passes following a reduction afterward. Yield stress and ultimate tensile stress reach a maximum after eight passes. The uniform elongation attains its minimum after eight passes. Reduction in dislocation density, grain growth, formation of Moiré fringes and twinning after twelve passes of SSE are some of the evidences for the softening. The critical grain size for the formation of nano twins (the onset of grain growth) is predicted. Prosperous prediction of yield stress using a strength-structure relationship helps in the understanding of the effect of dislocation density and microstructural observations.