کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
5456639 1514664 2017 5 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Evolution of bonding interface in Al/Al-Mg-Si alloy clad wire during heating at 500 ℃
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد دانش مواد (عمومی)
پیش نمایش صفحه اول مقاله
Evolution of bonding interface in Al/Al-Mg-Si alloy clad wire during heating at 500 ℃
چکیده انگلیسی
Fusing of bonding interface which could lead to the combination of grains at the both sides of bonding interface, and transition of bonding interface into grain boundary occurred during heating. Both they could strengthen interface bonding, and interface bonding strength was more than doubled after heating for 6 h.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Science and Engineering: A - Volume 679, 2 January 2017, Pages 538-542
نویسندگان
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