کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
545764 871849 2008 7 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Pressure-induced tin whisker formation
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Pressure-induced tin whisker formation
چکیده انگلیسی

This paper presents a fundamental assessment of pressure-induced tin whisker formation. A creep-based tin whisker model was developed to explain experimental data as well as data from industrial studies. A grain boundary diffusion model was then developed to predict a maximum whisker length. It is shown that creep properties obtained from samples can be used to screen plating finishes susceptible to tin whiskering. This enables a manufacturer to assess tin whisker risks prior to volume production.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 48, Issue 7, July 2008, Pages 1033–1039
نویسندگان
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