کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
545883 871854 2008 7 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
An approach of numerical multi-objective optimization in stacked packaging
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
An approach of numerical multi-objective optimization in stacked packaging
چکیده انگلیسی

The main aim for the development of small electronic packages is supported by an ongoing development of portable communication devices. Thin silicon dies are believed to improve the device performance as well as its reliability. Additionally, novel packaging techniques such as stacked packaging reduce packaging cost and size, and improve the functionality and reliability. In the case of the stacked packages, wafers are stacked to form a 3D multi-chip package. On the other hand, the electronic market requires novel and efficient numerical designing tools to deal properly with the optimization. The goal of the current work was to design a reliable numerical model of the stacked package and afterwards perform numerical multi-objective optimization in reference to a number of variables, which influence the stacked package reliability.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 48, Issue 6, June 2008, Pages 851–857
نویسندگان
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