کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
545916 871857 2008 13 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Packaging parameter analysis and optimization design on solder joint reliability for twin die stacked packages by variance in strain energy density (SED) of each solder joint
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Packaging parameter analysis and optimization design on solder joint reliability for twin die stacked packages by variance in strain energy density (SED) of each solder joint
چکیده انگلیسی

In accordance with vigorous development of the electronic product market as well as the consumers’ preference for smaller scales, the structure of 3D stacked die package rapidly becomes popular. Hereafter the stacked process of the silicon dies always makes the coupling effect among materials more complicated. Such an issue has been seriously paid attention to and becomes a critical problem to be solved for the product reliability. In this paper, the ANSYS software is adopted to analyze a twin die stacked package under a cyclic thermal loading condition. The viscoplastic finite element analysis and the Darveaux theory are applied to investigate the solder joint reliability (SJR) of the stacked die package. This research will verify a significant dependence between the solder joint fatigue life of the stacked die package and the distribution of the accumulated strain energy density (SED) on the solder joints by proposing a viewpoint of the variance of the strain energy density among solder joints for a 3D-Slice model.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 48, Issue 1, January 2008, Pages 119–131
نویسندگان
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