کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
546090 1450563 2006 6 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Thermal performance impacts of heat spreading lids on flip chip packages: With and without heat sinks
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Thermal performance impacts of heat spreading lids on flip chip packages: With and without heat sinks
چکیده انگلیسی

Heat spreading lids on a flip chip package can provide many thermal and mechanical advantages. Major drawbacks are higher module costs and potentially poorer thermal performance with a heat sink. This study compares thermal performance of direct lid attach (DLA) and bare die flip chip packages and addresses the roles of interface resistance and lid thickness. The IBM SLCTM package is tested and modeled. JEDEC standard wind tunnel tests as well as CFD models are used for analysis. The study reveals that the DLA design without additional heat sinking can provide significantly better thermal performance compared to the bare die package, depending on package size and airflow rate. With a heat sink the performance of the lidded package can be superior or inferior depending on interface resistance, lid design and the standard used for comparison.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 46, Issues 2–4, February–April 2006, Pages 380–385
نویسندگان
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