Use of signal processing imaging for the study of a 3D package in harsh environment

Assembly technologies follow the reduction in size of circuit board components and correlatively the number of active layers increases significantly. Therefore, during a conventional acoustic analysis, the obtained image becomes more and more complicated to analyze. In a previous paper, we focused our research on a method for a suitable visualization of the timescale of an acoustic signal (CWT). In this paper we present the use of the non-destructive control for the study of a 3D package submitted to accelerated ageing tests using harsh conditions.