کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
546296 871879 2006 12 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages
چکیده انگلیسی

Solder bumps serve as electrical paths as well as structural support in a flip-chip package assembly. Owing to the differences of feature sizes and electric resistivities between a solder bump and its adjacent traces, current densities around the regions where traces connect the solder bump increase in a significant amount. This current crowding effect along with the induced Joule heating would accelerate fatigue failure due to electromigration. In this paper we apply the three-dimensional electrothermal coupling analysis to investigate current crowding and Joule heating in a flip-chip package assembly carrying different constant electric currents under different ambient temperatures. Experiments are conducted to calibrate temperature-dependent electric resistivities of solder alloy, Al trace, and Cu trace, and to verify the numerical model by comparing calculated and measured maximum temperatures on the die surface. Through the electrothermal coupling analysis, effects of current crowding and Joule heating induced by different solder bump structures are examined and compared.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 46, Issue 8, August 2006, Pages 1357–1368
نویسندگان
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